All IDTechEx Research reports : Semiconductors, Computing & AI

Market for 3D electronics, covering electronics on 3D surfaces, in-mold electronics, fully additive 3D electronics, metallization methods, additive electronics materials, and applications.

6G, sub-THz, 6G technology benchmarking, Non-Terrestrial Networks (NTN), LEO, Reconfigurable Intelligent Surface (RIS), cell-free massive MIMO, THz components, low-loss materials, packaging, heterogeneous integration, player landscape

Heterogeneous Integration, AI, High Performance Computing (HPC), Data Centers, Autonomous Vehicles, 5G, Semiconductor Packaging Market Forecast, Antenna in Package, 2.5D, 3D, Fan-Out, FOWLP, FOPLP, Through-Si-Via, Glass Packaging, Co-Packaged Optics, RDL

Technology analysis and market forecasts for the global sale of AI chips by geography, processing type, architecture, packaging, application, and industry vertical, in addition to calculations for the costs associated with leading-edge AI chips.

Technology analyses and market forecasts for the global sale of AI chips for edge applications by geography, architecture, packaging, end-user, application, and industry vertical.

Artificial intelligence (machine learning and deep learning) in virtual screening, de novo drug design, lead optimization, and chemical synthesis planning.

Benchmarking 60+ companies for image recognition AI performance, market readiness, value proposition, technical maturity and more. Granular forecasts for 12 clinical applications, insights into addressable market size and penetration until 2030.

AiP, Antenna, Advanced Semiconductor Packaging, Substrate technology, 5G, 6G, Phased array, fan-out, flip-chip, glass, LTCC, HDI, EMI, Beamforming

Adoption of radar enabled ADAS functions, new radar technologies, emergence of 4D imaging radar, imaging radar benchmarking, automotive radar market forecast, leading tier 1 and tier 2 products, radar tier 1 supplier market share.

Telehealth, telemedicine, remote patient monitoring, consumer health wearables, digital therapeutics, & artificial intelligence in medical diagnostics

Global demands, market trends and market forecasts for electrically conductive adhesives (ECAs), including isotropic conductive adhesives (ICAs), anisotropic conductive pastes (ACPs) and anisotropic conductive films (ACFs).

Materials, methods and applications for electromagnetic interference (EMI) shielding including package-level shielding, sputtering, printing, conductive inks, MXenes, nanocarbons, heterogeneous integration, system-in-package, compartmentalization.

Covering applications such as wearable electronics, prototyping automotive electronics, and smart packaging, along with underlying technologies including conductive inks, flexible ICs, component attachment materials/methods and R2R manufacturing.

2.5D, 3D, advanced semiconductor packaging, RDL, dielectric material, Cu-Cu hybrid bonding, EMC, MUF

Data-centric approaches for design and discovery within materials science. Notable advancements in data infrastructures, machine learning, and AI. Player profiles, technology progression, market outlook, strategic approaches.

Covering Reconfigurable Intelligent Surfaces, radar beamforming, anti-reflection coatings, laser glare protection, metalenses and LiDAR beam-steering. Forecasts of revenue, surface area, and units 2024-2034

Covering tandem, thin-film, flexible, and building-integrated perovskite solar cells, along with perovskite LEDs, sensors and photodetectors

Quantum random number generators, quantum key distribution, terrestrial optical networks and space-based satellite quantum networks for the next generation of cryptographic security

Market analysis of hardware enabling quantum computing. Includes twenty-year quantum computing market forecasts, with superconducting, photonic, silicon-spin, neutral-atom, trapped-ion, diamond defect, topological, and annealing categories.

Atomic clocks, quantum gyroscopes, quantum magnetic field sensors, quantum gravimeters and quantum image sensors. Technology landscapes, market players, granular quantum sensor market forecasts and interview-based company profiles.

Comprehensive overview of the technologies, applications, trends, and opportunities in the quantum computing market, quantum sensing market, and quantum communications market as well as the overarching trends in quantum material development.

Semiconductor materials trends within electric and autonomous vehicles, battery management system (BMS), microcontrollers (MCU), Systems on chips (SoCs), ADAS, LiDAR, radar, 5G connectivity. Silicon (Si), Gallium Nitride (GaN), Silicon Carbide (SiC).

Compound Semiconductors, Transceivers, Indium Phosphide/InP PICs, Thin-Film Lithium Niobate/TFLN PICs, PICs for Quantum, Light-based Interconnects, Manufacturing, Materials, Co-Packaged Optics

Covering sustainable, green electronics, materials and manufacturing, integrated circuits, printed circuit boards, PCBs, printed, flexible, and hybrid electronics.

Sub-6 GHz and mmWave 5G in infrastructure and smartphones. Antenna developments, mMIMO, power amplifiers, semiconductor technologies, die attach materials and thermal interface materials.

Air Cooling, Liquid Cooling, Direct-to-Chip/Cold Plate Cooling, Immersion Cooling, Single-Phase and Two-Phase Cooling, Coolant Distribution Units (CDU), Pumps, and Hyperscale Data Centers.

Granular ten-year TIM, die-attach and substrate-attach market forecasts for Si IGBT, SiC MOSFETs, and GaN. Liquid Cooling forecast for inverters and motors. Power module suppliers' profile and supply chain analysis.

Covering emerging thin film photovoltaics, perovskites, organics, dye sensitized, cadmium telluride, copper indium gallium selenide, gallium arsenide, amorphous silicon, copper zinc tin sulfide, all-perovskite tandem, and perovskite on silicon tandem